HY810-2g HY883-3g/5g Silicone Thermal Paste Heat Transfer Grease Heat Sink CPU GPU Chipset Notebook Computer Cooling Syringe
HY810-2g HY883-3g/5g Silicone Thermal Paste Heat Transfer Grease Heat Sink CPU GPU Chipset Notebook Computer Cooling Syringe Original price was: ৳ 170.00.Current price is: ৳ 160.00.
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KOOCU V900 Precision Soldering Iron
KOOCU V900 Precision Soldering Iron Original price was: ৳ 650.00.Current price is: ৳ 510.00.
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HY880 Thermal Paste Kit

Attribute  Value
Color Grey
Thermal Conductivity >5.15 W/m·k
Thermal Impedance <0.004 °C-in²/W
Specific Gravity >2.79 g/cm³
Operation Temperature -20 to 130 °C
Moment Beared Temp. (Instantaneous Limit) -30 to 150 °C (some sources list higher ranges up to -30 to 280°C)
Composition Silicone compounds (10%), Carbon compounds (45%), Metal Oxide compounds (45%)
Safety Features Non-toxic, odorless, non-corrosive, non-volatile, not electrically conductive, flame retardant

Original price was: ৳ 400.00.Current price is: ৳ 250.00.

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Description

Features and Use Cases
  • Application: The HY880 is suitable for a wide range of applications requiring efficient heat dissipation, including desktop computers, notebooks, communication equipment, and high-power LED lighting.
  • Performance: It is described as a high-performance, cost-effective solution for mid to high-end applications, ensuring heat generated by the CPU or GPU is effectively dissipated.
  • Durability: The paste offers high stability and reliability and is designed to maintain its performance over a long period without compromising, drying out, or becoming less effective.
  • Ease of Use: It has an ideal consistency that makes it easy to apply, even for beginners, and since it is not electrically conductive, there is no risk of short circuits. 
The product is available in various packaging sizes, including syringes, tubes, and cans, to suit different user needs. 

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